GIGABYTE TECHNOLOGY Co. Ltd has unveiled the latest Intel B760 series motherboards. With enhanced XMP and hardware design of memory, the full B760 DDR5 lineup can achieve superb Z790-like memory performance of DDR5-7600. Featuring up to 16+1+1 phases of 60 amps digital power VRM design with full-coverage heatsink, GIGABYTE’s B760 lineup provides premium power and thermal design for the high-frequency operation of Intel® 13th gen processors. Meanwhile, the innovative PCIe® and M.2 EZ-Latch technology are implemented to simplify the upgrade of graphics cards and M.2 SSDs, and to avoid accidental damage to the surrounding components. Moreover, the features of 2.5 GbE LAN, Wi-Fi 6E, USB 3.2 Gen 2×2 Type C with 20 Gbps, and up to 3 sets of PCIe® 4.0 x4 M.2 slots with armor on select models offer superb connectivity. Further with the latest GIGABYTE PerfDrive technology and GCC software platform, GIGABYTE delivers the outstanding B760 platform with the optimal hardware, software, and firmware which covers from DDR4 to DDR5 with full form factor options of ATX, Micro ATX, and Mini ITX.
In the Intel® product plan, the “Z” chipset is the only platform to support CPU and memory overclocking. However, the B chipset with limited DDR frequency tuning offers more budget-friendly options, especially those that only require memory overclocking. In order to provide solid power for high-performance operation of CPU and XMP overclocking, GIGABYTE B760 AORUS motherboards are geared up to 16+1+1 power phases with 60 amps DrMOS design, while the well-received B760 AORUS ELITE features 12+1+1 power phases, and the leading power design of 14+1+1 phases on B760M AORUS PRO. These power designs allow GIGABYTE B760 AORUS motherboards of all configuration to deliver the most stable power, as well as to provide sufficient power when the CPU runs full loading. Meanwhile, enhanced by a full-coverage heatsink, 5 W/mK thermal pad, and 2x copper PCB, B760 AORUS MASTER/ PRO/ ELITE/ GAMING X lineup covers from ATX to micro ATX models boast superb thermal design to improve the stability and keep the power supply area which is most likely to generate heat staying cool.
Intel® B760 chipset offers friendly RAM support on both DDR4 and DDR5 just like the Z790 chipset, and GIGABYTE prepares a complete lineup with DDR4 and DDR5 compatibility for the market. GIGABYTE B760 DDR5 motherboards are implemented with server-level 6 layers low-loss PCB and the new generation Shielded Memory Routing. The trace width and length of the DDR5 memory layout is optimized by simulation from HPC, and is shielded under PCB inner layer from external interference which can greatly improve memory and overclocking performance. In addition, the multiple BIOS settings of Lower Latency, High Bandwidth further unleash the optimum XMP and EXPO memory performance. This design takes the memory overclocking performance of the GIGABYTE B760 platform to the next new level with the Z790-like speed of XMP DDR5-7600.
GIGABYTE has worked closely with world-renowned memory vendors to ensure superior memory compatibility, including ADATA, AORUS, Apacer, CORSAIR, CRUCIAL, G.SKILL, GEIL, GLOWAY, Kimtigo, KINGMAX, Kingston, Kingston FURY, KLEVV, Lexar, Micron, Neo Forza, OCPC, OLOY, PATRIOT, PNY, Samsung, TEAMGROUP, Thermaltake, Transcend, V-color. Keeping in mind that all memories can be perfectly compatible with GIGABYTE motherboards to exert the best performance, the GIGABYTE R&D team has completed compatibility tests for about 500 DDR5 memory modules and will continue to make sure that all systems built with GIGABYTE motherboards can provide superior performance.
GIGABYTE B760 AORUS and GAMING X ATX motherboards boast 3 sets of PCIe® 4.0 x4 M.2 up to 25110 form factor with at least one M.2 heatsink, and enlarged heatsink on select models. When running with the latest PCIe® 4.0 SSD, this design can unleash superior storage performance to 7000 MB/s without throttling. Furthermore, the M.2 EZ-Latch Plus technology replaces the existing M.2 SSD screws by auto locking latches, which reduces the troubles of screw alignment or loss to greatly simplify the M.2 SSD installation.
In addition to M.2 EZ-Latch, GIGABYTE B760 motherboards also feature PCIe® EZ-Latch technology which incorporates an enlarged latch and make it a lot simpler to detach installed cards. It can avoid the latch blocked by the bottom of the oversized graphics card and reduce the risk of accidentally damaging the board. Meanwhile, the next generation PCIe®x16 slots with reinforced tensile strength and robust design increase the shear resistance up to 2.2 times for more solid installation.
GIGABYTE’s B760 AORUS and GAMING lineup equip with upgraded 2.5Gb Ethernet for the demands of high-speed online gaming or storage, and WiFi 6E 802.11ax network on Wi-Fi models for the most flexible network options. Further, the AORUS B760 Micro-ATX motherboards offer full connectivity of USB 3.2 Gen 2×2 Type-C and front USB 3.2 Gen 2 Type-C for faster expansion and higher storage efficiency.
GIGABYTE exclusive PerfDrive technology integrated several BIOS settings to allow users easily balance between different levels of performance, power consumption, and temperature according to their needs when using 13th gen Intel® K-Sku Core™ processors. The Max Turbo mode activates the Turbo Boost setting of processors to unleash its maximum performance. The Optimization mode provides the perfect balance of optimized performance and low operation temperature. The Spec Enhance mode allows Intel® 13th gen Core™ CPU to carry out certain level performance at a lower temperature. The E-Core™ Disable mode allocates CPU resources to P-core exclusively to boost its performance and diminishes the overall power consumption of processors for better energy saving. Moreover, GIGABYTE also debuts new streamlined software management platform, called GCC (GIGABYTE Control Center) to categorize users’ GIGABYTE applications with newly designed UI and will automatically detect installed GIGABYTE hardware for easy driver installation.
GIGABYTE B760 motherboards are now available in the market.